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New plasma trick could unlock smaller, more powerful computer chips
A new technique could solve one of the biggest challenges in making future computer chips from ultrathin materials. Researchers found that coating molybdenum disulfide with oxygen or fluorine lets manufacturers remove just the top layer of atoms much more safely during plasma processing. The result is a cleaner, more controlled path toward smaller and more capable electronics.
The article mentions that the new plasma processing technique can work at lower temperatures, but it doesn't explain how this actually enables smaller chips - does this mean the process can be more precise at the atomic level, or is it primarily about reducing energy costs during manufacturing?